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Cadence and Intel Foundry Collaborate on Systems Foundry Enablement for the AI Era

Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the achievement of several key milestones in its ongoing strategic partnership with Intel Foundry. Furthering the companies’ collaboration on 3D-IC enablement, EDA flows and IP development across multiple Intel process nodes, beginning with Intel 18A Cadence announced the availability of a complete Embedded Multi-die Interconnect Bridge (EMIB) 2.5D advanced packaging flow, enhancements to the Intel 18A digital and custom/analog flows, a wide-ranging IP portfolio and the corresponding process design kits (PDKs) across various process nodes.

Key milestones of the ongoing Cadence-Intel Foundry collaboration include:

“Our close collaboration with Intel Foundry on 3D-IC enablement, EDA flows and IP is yielding significant results for mutual customers developing complex AI-enabling semiconductors and electronic systems,” said Tom Beckley, senior vice president and general manager, Custom IC & PCB Group at Cadence. “The availability of the complete EMIB 2.5D advanced packaging flow and other key milestones demonstrate the strength of our partnership and our commitment to delivering next-generation system innovations.”

“The challenges of system-level exploration and optimization require co-design and co-optimization from RTL through package, board and system,” said Suk Lee, VP & GM, Ecosystem Technology Office, Intel Foundry. “We rely on Cadence as one of the key ecosystem partners to deliver best-in-class AI-powered EDA solutions and IP technology in pursuit of our goal to be a systems foundry for the AI era.”

About Cadence

Cadence is a pivotal leader in electronic systems design, building upon more than 30 years of computational software expertise. The company applies its underlying Intelligent System Design strategy to deliver software, hardware and IP that turn design concepts into reality. Cadence customers are the world’s most innovative companies, delivering extraordinary electronic products from chips to boards to complete systems for the most dynamic market applications, including hyperscale computing, 5G communications, automotive, mobile, aerospace, consumer, industrial and healthcare. For 10 years in a row, Fortune magazine has named Cadence one of the 100 Best Companies to Work For. Learn more at cadence.com.

© 2024 Cadence Design Systems, Inc. All rights reserved worldwide. Cadence, the Cadence logo and the other Cadence marks found at www.cadence.com/go/trademarks are trademarks or registered trademarks of Cadence Design Systems, Inc. PCI Express and PCIe are registered trademarks or trademarks of PCI-SIG. Universal Chiplet Interconnect Express and UCIe are registered trademarks or trademarks of the UCIe Consortium. All other trademarks are the property of their respective owners.

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